† Corresponding author. E-mail:
Project supported by the Science Challenge Project, China (Grant No. TZ2016003-1-105) and the CAEP Microsystem and THz Science and Technology Foundation, China (Grant No. CAEPMT201501).
Understanding hydrogen diffusion in amorphous SiO2 (a-SiO2), especially under strain, is of prominent importance for improving the reliability of semiconducting devices, such as metal–oxide–semiconductor field effect transistors. In this work, the diffusion of hydrogen atom in a-SiO2 under strain is simulated by using molecular dynamics (MD) with the ReaxFF force field. A defect-free a-SiO2 atomic model, of which the local structure parameters accord well with the experimental results, is established. Strain is applied by using the uniaxial tensile method, and the values of maximum strain, ultimate strength, and Young’s modulus of the a-SiO2 model under different tensile rates are calculated. The diffusion of hydrogen atom is simulated by MD with the ReaxFF, and its pathway is identified to be a series of hops among local energy minima. Moreover, the calculated diffusivity and activation energy show their dependence on strain. The diffusivity is substantially enhanced by the tensile strain at a low temperature (below 500 K), but reduced at a high temperature (above 500 K). The activation energy decreases as strain increases. Our research shows that the tensile strain can have an influence on hydrogen transportation in a-SiO2, which may be utilized to improve the reliability of semiconducting devices.
The transportation of mobile impurities in dielectrics of semiconductor devices, such as metal–oxide–semiconductor field effect transistor (MOSFET), has been an intriguing topic, because it is closely related to the device reliability in harsh environments. Hydrogen is the most widely studied mobile species in amorphous silicon dioxide (a-SiO2), the most common material used as the gate dielectric in MOSFETs. Protons (positively charged hydrogen atoms) may drift toward Si/SiO2 interface in a manner of hopping between the fixed defects in a-SiO2 under a bias voltage. They will then de-passivate the hydrogen-saturated dangling bonds at the interface,[1,2] which generates the electrically-active dangling bond defects and results in device performance degrading.[3–5] Negative bias temperature instability (NBTI) is known as the most prevalent aging mechanism in MOSFETs, which increases the threshold voltage and limits the lifetime.[6–8] Reaction diffusion models for both atomic and molecular hydrogen have been proposed and verified experimentally to explain NBTI.[6,9] Strain is suspected to influence NBTI by distorting a-SiO2 lattice, and thus influencing hydrogen diffusion. However, the hydrogen atom diffusion in strained a-SiO2 is rarely investigated.
The experiments and theories mostly focused on hydrogen diffusion in a-SiO2 without strain. Using ab initio density-functional calculation, the energetics and dynamics of neutral hydrogen in α-crystobalite were explored.[10] It was discovered that a neutral hydrogen atom migrates by hopping between the local energy minima in the open voids. In addition, it was derived that the diffusivity is 8.1 × 10−3 cm2/s at 600 K and that the activation energy is 0.2 eV. The proton mobility was experimentally addressed by directly measuring the charge displacement,[11] and a short-time behavior involving an activation energy of 0.38 eV was discovered. Despite the limited range of studied temperature, the experiment strongly supported the calculation on the proton diffusion in a-SiO2,[12] thus concluding that the cross-ring inter-oxygen hopping assisted by network vibrations is the dominant diffusion mechanism of proton in a-SiO2 and the activation energy is 0.5 eV. Recently, by using MD simulations, the proton diffusion in a-SiO2 under strain was investigated in two temperature ranges.[6] It was shown that the activation energy is not influenced by the strain and varies around 0.07 ± 0.02 eV at low-temperature, and that on the contrary, the activation energy increases linearly with strain increasing at high-temperature. This result implied that the strain can be utilized to reduce proton diffusion in an a-SiO2 gate dielectric material. However, the mechanism behind the obvious discrepancy between the experimental values of hydrogen diffusivity was unclear, as the charge state of hydrogen that may affect the transportation was undetermined. In fact, it was shown by ab initio calculations that neutral hydrogen atom was thermodynamically unstable in a-SiO2.[13] However, the neutral hydrogen atom was experimentally detected in a-SiO2.[14] It was shown by ab-initio calculation that hydrogen atom in a-SiO2 can be neutral and non-bonded interstitial atom, positively charged and bonded to O atom, or negatively charged and bonded to Si atom.[15,16]
In this work, hydrogen diffusion in a-SiO2 under strain is simulated by using classical molecular dynamics (MD). A diffusion mechanism parallel to the proton hopping is proposed for the neutral hydrogen atoms in a-SiO2. The diffusivity and activation energy of hydrogen atom in strained a-SiO2 are derived from the transportation paths simulated by MD. It is shown that applying 3% tensile strain can remarkably reduce the diffusivity at high temperature (above 500 K), although it lowers the activation energy to 1/3 of the value in the case of no strain. This effect may be utilized to control hydrogen diffusion in semiconducting devices.
The a-SiO2 model was first constructed by simulating the melting and subsequently quenching of crystalline silica (c-SiO2) through using the Large-scale atomic/molecular massively parallel simulator[17] (LAMMPS) with the ReaxFF force field.[18] The unit cell of cristobalite silica[19,20] with 1152 atoms and a size of 20.25 Å × 30.50 Å × 28.15 Å was first heated at 8000 K for 200 ps with an isothermal and isochoric (NVT) ensemble. The heating temperature and duration were sufficient to melt the c-SiO2 unit cell and completely remove the memory of the initial crystalline structure. The unit cell was subsequently quenched from 8000 K to room temperature (300 K) by using an NVT ensemble at 5 K/ps.[21–25] The cooled silica was further relaxed at 300 K and 1 atm for 200 ps with an isothermal and isobaric (NPT) ensemble to approach to the equilibrium structure of a-SiO2. Nose–Hoover thermostat and Berendsen barostat were used to control the temperature and pressure in the simulations. The MD time step was 0.5 fs in all simulations. The a-SiO2 structure generated by classical MD was then optimized at 0 K by using ab-initio calculation based on the density functional theory (DFT). The structure relaxation was implemented by the Vienna ab initio simulation package (VASP).[26] The cut-off energy was set to be 400 eV, and breaking conditions of electronic and ionic loops were 10−3 eV and 10−2 eV/Å, respectively. The Brillouin-zone (BZ) integration was performed only at the Γ-point, since the a-SiO2 unit cell was sufficiently large. The initial c-SiO2 and the final a-SiO2 structures are shown in Fig.
The a-SiO2 model was loaded under uniaxial tension along the x-axis. The strain ε was introduced by stretching the a-SiO2 model, and defined as
The diffusivity was calculated from the mean square displacement (MSD) derived from the trajectories of seven hydrogen atoms randomly placed in the a-SO2 sample.[6,27–29] The simulations were carried out at four different temperatures (500 K, 800 K, 1000 K, 1500 K) using an NVT ensemble with a duration of 300 ps in time steps of 0.5 fs. The MSD was computed from the trajectories of the hydrogen atoms traced in the simulations by the equation
There is no coordination defect in the a-SiO2 model, i.e., each Si atom is bonded to four O atoms and each O atom is bonded to two Si atoms. The density, average bond length and angle, and the peaks of the radial distribution function (RDF) of the a-SiO2 model are listed in Table
The stress–strain curves of the a-SiO2 model under the uniaxial tension are shown in Fig.
The stress–strain curves show a linear elastic behavior if the strain is less than 1% (Fig.
The influences of the tensile strain on the Si–O bond length, and the O–Si–O and Si–O–Si bond angle under the strain values of 0%, 5%, 10%, 15%, and 20% are displayed in Fig.
The diffusion trajectory of a single hydrogen atom at 1000 K is shown in Fig.
It was shown by the previous calculations that neutral hydrogen atom is thermodynamically unstable in a-SiO2 and that either positively or negatively charged hydrogen atom is stable, depending on the Fermi level.[13] In the DFT simulation of proton diffusion, the proton was observed to vibrate around an equilibrium position and the trajectory of the proton vibration was approximately in the Si–O–Si plane with an average H–O distance of about 1.1 Å.[12] The proton hopping was assisted by the vibration of the Si–O framework. The hopping to the nearest-neighbor oxygen was infrequent, compared with the crossing-ring hopping, in which process the shortest O–O distance was about 2.5 Å. The hopping mechanism was confirmed by using classical MD simulations,[6] and it was concluded that the hydrogen atom diffused in a-SiO2 in the form of the proton. However, it was observed that the average H–O length was 2.1 Å and the crossing-ring O–O distance involved in the hopping was about 4.2 Å in the simulations.
Our simulations, however, show that the proton hopping mechanism can be paralleled by another mechanism, where the hydrogen atom is in neutral charge state. In fact, the hydrogen atom will be neutral, if located at the local energy minimum in an oxygen cage, where it keeps vibrating for a long time (several hundred picoseconds) but is not bonded to any oxygen atom (Fig.
Diffusivity as a kinetic quantity can be written in Arrhenius form, which is determined by two important parameters: activation energy and pre-exponential factor (D0). The activation energy measured in experiment spreaded from 0.05 eV to 0.9 eV.[6,10–12,44,45] Specifically, for neutral atomic hydrogen, in dense oxides the activation energy was measured to be between 0.1 eV and 0.2 eV, whereas in open silica channels the barrier was found to be lower, about 0.05 eV.[10,14,46,47] However, the pre-exponential factor is experimentally measured rarely.[10] Specifically, in wet fused silica, the pre-exponential of hydrogen atom was estimated at 1 × 10−4 cm2/s in theory.[10,14,33] The logarithm of the calculated diffusivity (ln D) is plotted and linearly fitted against inverse temperature (1/kT) in Fig.
The influences of the strain on the calculated diffusivity at different temperatures is shown in Fig.
The calculated activation energy of hydrogen atom diffusion is plotted against strain in Fig.
The strain effect on the activation energy is further investigated by calculating the microscopic diffusion barriers at different strains in Fig.
We perform atomic-scale simulations to investigate the diffusion of hydrogen atom in a-SiO2 and the influence of strain on diffusivity and activation energy. The a-SiO2 model is prepared and its structural parameters (mass density, average Si–O bond length, Si–O–Si and O–Si–O bond angles, and the first-peaks of RDFs) are compared with the measurements and calculations. Uniaxial strain is then applied to the model at different tensile rates. The stress–strain response stiffens and achieves higher strength and strain to failure as the tensile rate increases. In addition, we also find Young’s modulus enhancement with the increase of tensile rate. The diffusions of hydrogen atom in a-SiO2 are simulated at different values of strain. The simulations reveal another diffusion picture paralleling to the well-known cross-ring proton hopping, that is, the hydrogen atom mostly remains in neutral charge state and vibrates at a local energy minimum in an oxygen cage and hops to another local energy minimum in the adjacent cage assisted by the vibration of the a-SiO2 framework. By fitting the simulated diffusivity to the Arrhenius plot, the diffusion activation energy of the hydrogen atom is derived to be 0.57 eV in the case of no strain and decreases as the strain increases. Specially, it drops to about 1/3 of the intimal value as the strain increases from 0 to 3%. In addition, the diffusivity shows opposite trend with increasing strain, depending on the temperature. It generally increases as the strain increases at 500 K but decreases at 1000 K and 1500 K. More than that, applying 3% strain can drastically lower the diffusivity down by about 13.3 times at 1500 K. This implies that the strain may be utilized to efficiently inhibit hydrogen diffusion at a relatively high temperature. This research may help to understand hydrogen atom diffusion in a-SiO2 on an atomic scale and to optimize the fundamental processing of semiconducting devices based on Si/a-SiO2 interface, for which the reliability issues are directly related to hydrogen and its diffusion in a-SiO2 are critical.
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